Produktdetaljer
ISBN
9783036406343
Publisert
2024-08-28
Utgiver
Vendor
Trans Tech Publications Ltd
Vekt
340 gr
Høyde
240 mm
Bredde
170 mm
Dybde
6 mm
Aldersnivå
P, 06
Språk
Product language
Engelsk
Format
Product format
Heftet
Antall sider
114
This special collection examines the intrinsic properties of semiconductor wafers and substrates, their mechanical, electrical, and thermal characteristics, and also the latest developments in SiC wafer production and processing, substrate preparation, and their integration into high-tech products which are critical to the functionality and reliability of modern electronic devices. By bringing together research and practical insights, the special edition will be a valuable resource for scientists and industry specialists seeking to harness the full potential of silicon carbide in the evolving landscape of innovation in semiconductor technologies.
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<p>Special topic volume with invited peer-reviewed papers only</p>
- Preface
- SmartSiC™ Substrates: A Boon to Drain Metallization Process
- Surface Structuring of Patterned 4H-SiC Surfaces Using a SiC/Si/SiC Sandwich Approach
- HYPREZ Wafering Solutions: A Novel Approach of SiC Wafering Solution
- Poly-SiC Characterization and Properties for SmartSiC™
- Application of Advanced Characterization Techniques to SmartSiC™ Product for Substrate-Level Device Performance Optimization
- A Novel Approach for Thin 4H-SiC Foil Realization Using Controlled Spalling from a 4H-SiC Wafer
- High-Temperature Reorganization Behavior of Single-Crystalline Porous 4H-SiC Thin Foils
- Dicing Process for 4H-SiC Wafers by Plasma Etching Using High-Pressure SF6 Plasma with Metal Masks
- Investigations on the Recovery of the Electrical Properties of Smart Cut™-Transferred SiC Thin Film Using SiC-on-Insulator Structures
- Demonstration of SiC-on-Insulator Substrate with Smart Cut™ Technology for Photonic Applications
- A Novel Contactless SiC Wafer Planarization Processing after Mechanical Slicing by Dynamic Thermal Annealing Processes
- Proposal of Damage-Free SiC Wafer Dicing Using Water Jet Guided Laser
- In-Line Charaterization of HPSI SiC Wafers Using High Resolution Surface Photovoltage Spectroscopy (HR-SPS)
- Characterization of Very Thin 3C-SiC Epilayers on Si
Les mer
Produktdetaljer
ISBN
9783036406343
Publisert
2024-08-28
Utgiver
Vendor
Trans Tech Publications Ltd
Vekt
340 gr
Høyde
240 mm
Bredde
170 mm
Dybde
6 mm
Aldersnivå
P, 06
Språk
Product language
Engelsk
Format
Product format
Heftet
Antall sider
114