The International Conference on Silicon Carbide and Related Materials (ICSCRM) is the most important technical conference series on silicon carbide (SiC) and related materials. Started in Washington, D.C. in 1987, the conference series developed into a bi-annual global forum on SiC from its crystal growth to the reliability in application. After five conferences in the U.S., ICSCRM has been held every two years, alternating between USA, Europe, and Japan. The last three Conferences were held in Giardini Naxos, Italy (2015), Washington, D.C. , USA (2017), and Kyoto, Japan (2019). Due to the pandemic situation in 2020 and 2021, the alternating European edition, the 13th ECSCRM, has been held in 2021, and the 19th ICSCRM has been postponed to 2022. The 19th edition of ICSCRM will be the last of its kind – starting in 2023, the conference series will be united with the European edition. It will form an annual event under the well-established name ICSCRM and a new rotation schedule integrating the SiC communities worldwide.

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Selected peer-reviewed extended articles based on abstracts presented at the 19th International Conference on Silicon Carbide and Related Materials (ICSCRM) 2022

Aggregated Book

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  • Preface
  • Chapter 1: Growth and Wafer Manufacturing
  • Epitaxial Growth of Boron Carbide on 4H-SiC
  • Transfer of Heteroepitaxial Grown 3C-SiC Layers for Application in Optical Frequency Combs
  • Prevention of Bunched Basal Plane Dislocation Arrays in 4H-SiC PVT-Growth
  • Suppression of In-Grown SF Formation and BPD Propagation in 4H-SiC Epitaxial Layer by Sublimating Sub-Surface Damage before the Growth
  • Improvement of the Conformational Stability of 150 mm 4H SiC Wafers
  • Ni-Silicide Ohmic Contacts on 4H-SiC Formed by Multi Pulse Excimer Laser Annealing
  • High Quality Single Crystal Recrystallization of Thin 4H-SiC Films Deposed by PVD Techniques, a way for New Emerging Fields
  • In Situ Monitoring of the Ambient Gas Phase during PVT Growth of Nominally Undoped High Resistivity SiC Boules
  • Effect of Sub-Surface Damage Layer Removal by Sublimation Etching of 4H-SiC Bulk Wafers on PL Imaging of Crystal Defect Visibility
  • Study of GHz-Burst Femtosecond Laser Micro-Punching of 4H-SiC Wafers
  • 3C-SiC Island Growth on 4H-SiC Terraces: Statistical Evidence for the Orientation Selection Rule
  • Temperature Gradient Control with an Air-Pocket Design for Growth of High Quality SiC Crystal
  • Development of High Quality 8 Inch 4H-SiC Substrates
  • 4H-SiC Full Wafer Mapping Image of CMP-Finished Sub-Surface Damage by Laser Light Scattering
  • Tailored Polycrystalline Substrate for SmartSiCTM Substrates Enabling High Performance Power Devices
  • Investigation of the Nucleation Process during the Initial Stage of PVT Growth of 4H-SiC
  • Study on Estimation of Device Yield in Non-Epitaxial 4H-SiC Material Relating to Defect Densities Influencing Bipolar Degradation with XRT- Measurements
  • Al Implantation in SiC; Where Will the Ions Come to Rest?
  • High-Speed Plasma Etching of Gallium Oxide Substrates Using Atmospheric-Pressure Plasma with Hydrogen-Helium Mixed Gas
  • Transport Phenomena during Liquid Si-Induced 4H-SiC Surface Structuring in a Sandwich Configuration
  • Surface-Localized 15R Formation on 4H-SiC (0001) Si-Face by Laser Annealing for Power N-Type MOSFETs
  • Exploring UV-Laser Effects on Al-Implanted 4H-SiC
  • Benchmarking Experiment of Substrate Quality including SmartSiCTM Wafers by Epitaxy in a Batch Reactor
  • Optimizing Non-Contact Doping and Electrical Defect Metrology for Production of SiC Epitaxial Wafers
  • Quality Evaluation of 150 mm 4H-SiC Grown at over 1.5 mm/h by High-Temperature Chemical Vapor Deposition Method
  • Deep Level Reduction in 4H-SiC Treated by Plasma Immersion
  • Improving the Polishing Speed and Surface Quality of 4H-SiC Wafers with an MnO2- Based Slurry
  • Chapter 2: Material Characterization
  • Temperature Dependent Electrical Properties of N-Type 4H-SiC Substrates
  • Controlled Macrostepping of Si-Face 4°off 4H-SiC over a Large Area via Liquid Si-Induced Reconstruction
  • Evaluation of Hysteresis Response in Achiral Edges of Graphene Nanoribbons on Semi-Insulating SiC
  • Quantification of Secondary Electron Doping Contrast in the Scanning Electron Microscope on 4H-SiC
  • PL Signatures from Decoration of Dislocations in SiC Substrates and Epitaxial Wafers
  • Light Extraction from 4H Silicon Carbide by Nanostructuring the Surface with High Temperature Annealing
  • Characterization of Prismatic Slip in SiC Crystals by Chemical Etching Method
  • Recent Progress in Non-Contact Electrical Characterization for SiC and Related Compounds
  • Correlation between Q-Factor and Residual Stress in Epitaxial 3C-SiC Double-Clamped Beam Resonators
  • Selective Oxidation during AFM Electrical Characterization of Doped SiC Layers
  • Evaluation of Crystal Quality and Dopant Activation of Smart CutTM - Transferred 4H-SiC Thin Film
  • Accurate Determination of the Temperature Dependence of the Refractive Index of 4H-SiC at the Wavelength of 632 nm
  • Chapter 3: Defects
  • Correlation of Extended Defects with Electrical Yield of SiC MOSFET Devices
  • Strain-Dependent Photoluminescence Line Shifts of the TS Color Center in 4H-SiС
  • Minority Carrier Traps Induced by Neutron Reactions with 4H-SiC
  • Stacking Faults Originating from Star-Defects in 4H-SiC
  • P-Type Impurities in 4H-SiC Calculated Using Density Functional Theory
  • Charge State Control over Point Defects in SiC Devices
  • Investigation of Defect Generation and Propagation in Electrically and Photonically Stressed Silicon Carbide
  • The Optical Properties of the Carbon Di-Vacancy-Antisite Complex in the Light of the TS Photoluminescence Center
  • Basal Plane Dislocation Slip Band Characterization and Epitaxial Propagation in 4H SiC
  • High Sensitivity Surface Defect Inspection of SiC and SmartSiCTM Substrates Using a DUV Laser-Based System
  • Study of Defects in 4H-SiC Epitaxy at Various Buffer Layer Growth Conditions
  • S-EVC Method for Sorting Wafers with Defects that Extend to Bar Shaped SSFs
  • Analysis of Basal Plane Dislocation Motion Induced by p+ Ion Implantation Using Synchrotron X-Ray Topography
  • The Development of the Advanced Inspection System to Screen out the BPDs that Extend to Bar Shaped SSFs under Forward Biasing
  • Chapter 4: X-ray Analysis
  • Implementation of Large Scale Deep Learning Non-Destructive Methods for Characterizing 4H-SiC Materials
  • Analysis of Strain in Ion Implanted 4H-SiC by Fringes Observed in Synchrotron X-Ray Topography
  • Effective Penetration Depth Investigation for Frank Type Dislocation (Deflected TSDs/TMDs) on Grazing Incidence Synchrotron X-Ray Topographs of 4H-SiC Wafers
  • Evaluation of Strain in 3C-SiC/Si Epiwafers from X-Ray Diffraction Measurements
  • Chapter 5: MOS Interfaces and Processes
  • Outlook for Dielectric/SiC Interfaces for Future Generation MOSFETs
  • Passivation of Very Fast Near-Interface Traps at the 4H-SiC/SiO2 Interface Using Sodium Enhanced Oxidation
  • Influence of Post-Ion-Implantation Annealing Temperature on the Characteristics of Gate Oxide on 4H Silicon Carbide
  • Evolution of Interface State Density and Near Interface Oxide Traps under Controlled Nitric Oxide Annealing in SiO2/SiC Lateral MOSFETs
  • Oxide and Interface Defect Analysis of lateral 4H-SiC MOSFETs through CV Characterization and TCAD Simulations
  • The Influence of Extended Defects in 4H-SiC Epitaxial Layers on Gate Oxide Performance and Reliability
  • NO Annealing Simulation of 4H-SiC/SiO2 by Charge-Transfer Type Molecular Dynamics
  • Improvement of Interface Properties for Thermally Oxidized SiC/SiO2 MOS Capacitor by Post Oxidation Annealing Treatment
  • High Mobility Silicon Dioxide Layers on 4H-SiC Deposited by Means of Atomic Layer Deposition
  • Chapter 6: MOSFET Physics
  • Temperature Dependent Mobility Model for Predictive TCAD Simulations of 4H-SiC
  • Hypothesis to Explain Threshold Drift due to Dynamic Bipolar Gate Stress
  • Gate Dielectric Current Transport Mechanisms in N-SiC Metal Oxide Semiconductor Capacitor
  • Complications of Charge Pumping Analysis for Silicon Carbide MOSFETs
  • Heavy-Ion-Induced Defects in Degraded SiC Power MOSFETs
  • Physical Modelling of Charge Trapping Effects in SiC MOSFETs
  • Chapter 7: Devices and Optimization
  • A Modeling of 4H-SiC Super-Junction MOSFETs with Filtered High Energy Implantation
  • Threshold Voltage Adjustment on 4H-SiC MOSFETs Using P-Doped Polysilicon as a Gate Material
  • Fabrication of Quasi-Vertical GaN-On-SiC Trench MOSFETs
  • Demonstration of SiC Trench Gate MOSFETs with Narrow Cell Pitch Using Source Self-Aligned Process
  • Optimized 750V SiC MOSFETs for Electric Vehicle Inverter Operation
  • Assessing, Controlling and Understanding Parameter Variations of SiC Power MOSFETs in Switching Operation
  • Influence of Cell Design and Gate-to-Source Voltage on Avalanche Robustness of SiC MOSFET Integrated JBS Diode
  • Towards Sic-Based VUV Pin-Photodiodes - Investigations on 4H-SiC Photodiodes with Shallow Implanted Al Emitters
  • Enhanced Device Performance with Vertical SiC Gate-All-Around Nanowire Power MOSFETs
  • Optimizing PECVD a-SiC:H Films for Neural Interface Passivation
  • Suppression of Short Channel Effects for a SiC MOSFET Based on the S-MOS Cell Concept
  • High Density 65W AC-DC Adaptor Enabled by SiC MOSFET with Ultralow VGS(on)
  • Effect of Termination Region on Unclamped Inductive Switching Failure for 4H-SiC VDMOS
  • 650V Vertical SiC MOSFETs and Diodes with Improved Terrestrial-Neutron Single-Event Burnout
  • Numerical Analysis of the Schottky Contact Properties on the Forward Conduction of MPS/JBS SiC Diodes
  • A Fully Self-Aligned SiC Trench MOSFET with 0.5 μm Channel Pitch
  • Investigations on 4H-SiC Low Voltage nMOSFETs with Thin Thermal SiO2/ Deposited Oxide Gate Dielectric
  • Highly Efficient Floating Field Rings for SiC Power Electronic Devices - A Systematic Experimental Study
  • Reduction of Forward Bias Degradation in 4H-SiC PiN Diodes Fabricated on 4H-SiC Bonded Substrates
  • Fabrication of an Open Gate-4H-SiC Junction Field Effect Transistor for Bio-Related and Chemical Sensing Applications
  • Tailoring the Charge Carrier Lifetime Distribution of 10 kV SiC PiN Diodes by Physical Simulations
  • 10kV+ Rated SiC n-IGBTs: Novel Collector-Side Design Approach Breaking the Trade-Off between dV/dt and Device Efficiency
  • A Scalable SPICE Electrothermal Compact Model for SiC MOSFETs: A Comparative Study between the LEVEL-3 and the BSIM
  • Chapter 8: JFETs Device
  • Impact of Dimensions and Doping on the Breakdown Voltage of a Trench 4H-SiC Vertical JFET
  • Early Burn-In Parasitic Conduction in 500 °C Durable SiC JFET ICs
  • Optimization of TaSi2 Processing for 500 °C Durable SiC JFET-R Integrated Circuits
  • Chapter 9: Device Characterization
  • A Novel Non-Invasive Cryostatic Spectrometry Technique to Characterize the Carriers’ Multiplication Factor in Silicon Carbide Power Devices
  • Electroluminescence Spectra of a Gate Switched MOSFET at Cryogenic and Room Temperatures Agree with Ab Initio Calculations of 4H-SiC/SiO2-Interface Defects
  • Comparison of the Performance-Degrading Near-Interface Traps in Commercial SiC MOSFETs
  • SiC MOSFETs Biased C-V Curves: A Temperature Investigation
  • Body Diode of 1.2kV SiC MOSFET: Unipolar and Bipolar Operation
  • Pulsed Forward Bias Body Diode Stress of 1200 v SiC MOSFETs with Individual Mapping of Basal Plane Dislocations
  • Investigation on Switching Characteristics of 3.3kV SiC Power MOSFETs with SiO2/ SiN Gate Stack
  • Measurement and Analysis of Body Diode Stress of 3.3 kV SiC-Mosfets with Intrinsic Body Diode and Embedded SBD
  • Impact of Turn-Off Gate Voltage and Temperature on Threshold Voltage Instability in Pulsed Gate Voltage Stresses of SiC MOSFETs
  • Small-Signal Impedance and Split C-V Characterization of High-κ SiC Power MOSFETs
  • Lifetime Projection of Bipolar Operation of SiC DMOSFET
  • Chapter 10: Reliability
  • Bias-Induced Instability of 4H-SiC CMOS
  • On the Frequency Dependence of the Gate Switching Instability in Silicon Carbide MOSFETs
  • Robustness of SiC MOSFETs under Repetitive High Current Pulses
  • Reliability of SiC MOSFET Power Modules under Consecutive H3TRB and Power Cycling Stress
  • Chip-Top Packaging Technology for SiC Devices Operational at 250°C with Power-Cycling Durability of over 300,000 Cycles
  • Avalanche Robustness Investigation of SiC Avalanche Diodes at High Temperatures
  • AC-Stress Degradation in SiC MOSFETs
  • Power Cycling on Lateral GaN and β-Ga2O3 Transistors
  • Temperature Dependence of the Channel and Drift Resistance of SiC Power MOSFETs Extracted from I-V and C-V Measurements
  • Humidity Robustness of 3.3kV SiC-MOSFETs for Traction Applications - Compared to Standard Silicon IGBTs in Identical Packages
  • Reliability and Standardization for SiC Power Devices
  • Energy-Dependent Impact of Proton Irradiation on 4H-SiC Schottky Diodes
  • Impact of Bias Temperature Instabilities on the Performance of Power Electronics Employing SiC MOSFETs
  • Proven Power Cycling Reliability of Ohmic Annealing Free SiC Power Device through the Use of SmartSiCTM Substrate
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Produktdetaljer

ISBN
9783036401676
Publisert
2023-06-15
Utgiver
Vendor
Trans Tech Publications Ltd
Vekt
1530 gr
Høyde
240 mm
Bredde
170 mm
Dybde
42 mm
Aldersnivå
P, 06
Språk
Product language
Engelsk
Format
Product format
Heftet
Antall sider
836